Universal magnetron deposition system

The magnetron deposition system with variable system up to 3 magnetron with 2in targets in diameter. Various power supplies are available RF, DC, RF pulsed, DC pulsed for sputtering of metals or metal oxides. The deposition table can be heated up to about 200 oC or rotated. The RF bias can be induced on the substrate during the deposition and synchronized to target sputtering RF plasma.